2200 SERIES

INDUSTRIAL EPOXY RESINS

USAGE

These ThreeBond adhesives use industrial epoxy resin as their main component. They are excellent for a myriad of purposes including general purpose adhesion and sealing, and for electronic device bonding, filling, repair, casting and impregnation. Epoxy resins, also known as polyepoxides, are reactive prepolymers and polymers which contain epoxide groups. They often have favorable mechanical properties and high thermal and chemical resistance which make them ideal for a variety of industries and applications.

Many people choose industrial epoxy resins because they are familiar, especially for various applications. We most often see industrial epoxy resins being used in the following industries:

• Automotive
• Automotive electronics
• Consumer electronics
• EV and fuel cell manufacturing

With a large array of different types of epoxy resins readily available, our selection allows us to serve our customers’ every need. With black and white options, varying degrees of viscosity and lap shear strength, our industrial epoxy resins suit every job.

WHY CHOOSE THREEBOND INDUSTRIAL EPOXY RESINS?

As a business owner, you understand the importance of choosing the right supplies and materials the first time around. With such a huge selection of industrial epoxy resins, you can easily find solutions that will help to reduce overhead costs, reduce process steps, simplify the overall workflow and eliminate waste. We know that every dollar matters when it comes to working efficiently and we are here to be the partner you need to find the right solutions for every job.

It doesn’t take long to see how our industrial epoxy resins are uniquely designed to meet the high standards of our varying clients. From the automotive industry to consumer electronics, our industrial epoxy resins are designed to exceed your expectations and improve your workflow.

Use our data sheets below to help you find the perfect industrial epoxy resins for your application.

PRODUCT SPECIFICATIONS

Product Name Features and Uses Color Viscosity (Pa·s) Lap Shear Strength (MPa) Hardness Tg (°C) Thermal Conductivity (W/m·K) Curing
TB2202 Low-temp cure, trigger type; excellent adhesive & heat resistance Black 13 10 D88 105 60 °C × 180 min; 70 °C × 50 min; 70 °C × 20 min
TB2204 Low-temp cure, trigger type; excellent adhesive & heat resistance Black 28 13 D89 105 60 °C × 180 min; 70 °C × 50 min; 70 °C × 20 min
TB2206 Low-temp cure, trigger type; excellent adhesive & heat resistance Black 100 15.7 D87 107 60 °C × 180 min; 70 °C × 50 min; 70 °C × 20 min
TB2206B Low-temp cure, trigger type; excellent adhesive & heat resistance Black 140 17.7 D89 102 60 °C × 180 min; 70 °C × 50 min; 70 °C × 20 min
TB2206S Low halogen content, heat-curable epoxy resin Black 15 12 D87 106 80 °C × 30 min
TB2222P Solder heat‑resistant, high peel, thermal shock resistant Black 45 24 D89 115 100 °C × 60 min
TB2235L High Tg, high storage modulus, heat‑curable Black 80 23 D92 150 140 °C × 30 min
TB2237J High Tg/modulus, heat‑curable; good adhesion White 115 26 D89 150 120 °C × 60 min
TB2249G Heat‑curable, high shear & peel strength Black 75 39 D90 104 160 °C × 30 min
TB2249K Heat‑curable, high-strength, structural bonding; oily surface use Black 880 34.6 D81 118 130 °C × 30 min
TB2270J High heat dissipation; low expansion & shrinkage White 150 9 D96 117 4.2 100 °C × 40 min
TB2272F UL94 V‑0 flame‑retardant, heat‑curable Black 75 21 D92 117 100 °C × 60 min
TB2273E High Tg, high peel; induction-curable White 70 40 D94 120 150 °C × 30 min
TB2274 Low-temp cure, under-fill agent for CSP/BGA Black 12 11 D86 65 70 °C × 50 min
TB2274C Low-temp cure, under-fill for CSP/BGA Black 12 16 D83 80 85 °C × 60 min
TB2285 High heat resistance, high Tg; motor coil impregnation White 120 20 163 120 °C × 60 min

* Measurements are taken under the standard testing conditions for each grade.